Multiquip Tuck Point Blades Wafer Segmented
DRY/WET Cutting – Premium Grade
Wafer blade design for lightning fast material removal.
Cleans, routs mortar and masonry materials.
1/4 and 3/8 in wafer widths available.
Blade Diameters for Right Angle Grinders & Circular Saws.
Reference Series: WTK
HORSEPOWER | NA |
Manufacturer | Multiquip |
Category | Diamond Cutting Tools |
Subcategory | MQ Diamond Blades |
Model | Tuck Point Blades - Wafer Segmented |
Condition | New |
Hours | 0 |
Horsepower | NA |