Multiquip Tuck Point Blades Wafer Segmented

DRY/WET Cutting – Premium Grade
Wafer blade design for lightning fast material removal.
Cleans, routs mortar and masonry materials.
1/4 and 3/8 in wafer widths available.
Blade Diameters for Right Angle Grinders & Circular Saws.
Reference Series: WTK