Multiquip Tuck Point Blades Wafer Segmented
Multiquip Tuck Point Blades Wafer Segmented
Multiquip Tuck Point Blades Wafer Segmented Information
DRY/WET Cutting – Premium Grade
Wafer blade design for lightning fast material removal.
Cleans, routs mortar and masonry materials.
1/4 and 3/8 in wafer widths available.
Blade Diameters for Right Angle Grinders & Circular Saws.
Reference Series: WTK
Engine
| HORSEPOWER | NA |
Performance
Capacities
List of Features
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*New price, if shown, is Suggested List Price (SLP). Current national programs are subtracted. SLP and/or final actual sales price will vary depending on options or accessories selected.
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| Manufacturer | Multiquip |
| Category | Diamond Cutting Tools |
| Subcategory | MQ Diamond Blades |
| Model | Tuck Point Blades - Wafer Segmented |
| Condition | New |
| Hours | 0 |
| Horsepower | NA |
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